Packaging Strategies Conferences

May 7-9, 2008
Oak Brook Hills Marriott Resort
Oak Brook (Chicago), IL, USA

The World’s Most Content-rich Event for the Global Pouch/Retort Industry
 
 

The Global Pouch Forum & Technology Exhibition (formerly Stand-Up Pouches Conference) is widely recognized as the world's leading event focused on market trends, technologies, equipment, materials, and processes for stand-up and all pouch formats.

Craig Ostbo will share consumer response videos shot exclusively for the Global Pouch Forum about shoppers on their understanding of sustainability; what they believe makes a package sustainable; whether they buy products based on sustainability attributes; and, their perceptions of how pouches and other packaging formats fit that equation.


Compelling Value Propositions & Reasons To Attend

  • Hear balanced and unbiased perspectives on the entire pouch/flexible packaging segment, including materials, markets, components, and machinery
  • Develop your own new business development strategies based on what a panel of leading pouch/flexible packaging segment executives outline as their key critical areas of business focus through the end of the decade
  • Balance supply-side business strategies against the “wants, needs, and desires” shared by a panel of pouch-savvy brand-owners
  • Gain exclusive access to consumer perception study insights that illustrate what consumers understand and believe about pouches – and what compels them to reach for pouches vs. other package types at point-of-purchase
  • Hear an exclusive overview of a pre-commercial bio-based nanocomposite barrier pouch material
  • Learn about exciting new pouch technologies that were introduced just a week prior at InterPack 2008.
  • Learn with end-use segment is pegged as the next high-value, high-growth area – and which pouch structure is already poised to meet that need
  • Walk the only Pouch Technology & Services Expo to annually attract 50 leading global pouch technology and service providers
  • The Global Pouch Forum’s new Chicago/O’Hare area venue makes it the most convenient easy-in/easy-out location
Program and registration information will be posted as it becomes available.
Please click here to be added to our conference mailing list.

Sponsors:
CLP Packaging
Esko Artwork
Herrmann Ultrasonics
 
Industry Partners:

 

 
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