September 25, 2008

www.circuitree.com September Issue Events Buyer's Guide Classifieds

Week in Review

IPC Honors Volunteers for Contributions to
IPC Standards
and Program Development

Taiwan IC Makers Urged to Explore Semiconductor Market in China

IC Packaging and Testing Companies in Taiwan Set for Sequential Decline in Fourth Quarter

AT&S Selects Cimnet ERP System

Ellen Kullman Elected DuPont President

William King Appointed Datron President

Mania Belgium Appoints Scanditron Danmark

New IPC Guide to Environmental Megatrends Steers Companies Through Environmental Regulations and Issues

More headlines at www.circuitree.com.

Top Story

North American Semiconductor Equipment Industry Posts Book-to-Bill Ratio of 0.83
For August 2008, North America-based manufacturers of semiconductor equipment posted USD 884 million in orders and a book-to-bill ratio of 0.83, according to SEMI’s August 2008 Book-to-Bill Report. (Click here to read the full story.)

Featured Media

Pre-Forming
Flex Circuits
Mark Finstad, Minco

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Show Spotlight

This year, TCPA Show 2008 will be held at Taipei Nangan Exhibition Hall, from 10/22 to 10/24 in Taipei, Taiwan. It will consist of Taiwan PCB Exhibition, Assembly Expo Taiwan, and the new Green Tech Expo Taiwan. Specifically, the new applications of green technology, equipment, and materials for the PCB and electronic assembly industries will be introduced in the show.

September Issue

Features

New Halogen-Free Materials: Their Time Has Finally Arrived

PCB and Package Convergence

Editorial Spotlight

"Flexibility is the obvious primary benefit of using flexible circuits. This important feature allows for elements of an electronic system to be moved relative to each other either dynamically, such as one might find in a disc drive read-write head or a laptop computer hinge or statically folded into a shape that allows the assembly to be packaged in a smaller volume, which is the most common type of flex circuit application." — Joe Fjelstad

Read the Full Issue Online

Events

IPC Designers Day
October 22, 2008
Irvine, California

IPC/SMTA High Performance Electronics Assembly Cleaning Symposium
October 28 - 29, 2008
Rosemont, Ill.

2008 Intel Symposium on Environmentally Friendly Materials
Sponsored by iNEMI
November 11 - 12, 2008
Shanghai

2008 International Printed Circuit & Electronics Assembly Fair
December 3 - 5, 2008
Shenzhen, China

More events online.

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